Silver paste for touch screen, membrane circuit.
Application to ITO-PET film is possible. Wide array of usage purposes such as touch screen switch, membrane circuit formation, and EL element application.
| Products |
Outline |
Printability |
Sheet resistivity
（Film thickness 10μm） |
Viscosity
(at 25℃)
(VT-06) |
Curing
condition |
| LS-450-5 |
For fine printing application,
good adhesion to
various kinds of ITO |
70-80 μm |
65mΩ/□ |
600-800 dPa･s |
130℃×30min |
| LS-450-7H |
For fine printing application,
good adhesion to
thin film type ITO |
50-60 μm |
80mΩ/□ |
1100-1400 dPa･s |
130℃×30min |
| LS-460H-1 |
For fine printing application,
great with various screens |
50 μm |
90mΩ/□ |
1200-1800 dPa･s |
130℃×30min |
| LS-453-1 |
Low temperature curing type |
80-100 μm |
50mΩ/□ |
350-450 dPa･s |
100℃×30min |
Ag paste for laser cutting process
| Products |
Outline |
Workability
(L/S) |
Sheet resistivity
（Film thickness 10μm） |
Viscosity
(at 25℃)
(VT-06) |
Curing
condition |
| LS-470L-2 |
General-purpose product |
30/30 μm |
85mΩ/□ |
350-450 dPa･s |
130℃×30min |
| SNP-210L |
Lowes-cost,
Large particle reduced product |
20/20 μm |
70mΩ/□ |
200-400 dPa･s |
130℃×30min |
| SNP-300L-SP3 |
Low temperature curing,
Large particle reduced product |
20/20 μm |
70mΩ/□ |
350-450 dPa･s |
80℃×30min |
Silver paste for EMI shielding
By securing specified film thickness, it is possible to obtain good EMI shielding effect.
Charactecteristics such as high-flexibility can be maintained even during bending tests in low temperature environments.
| Products |
Outline |
Printability
(L/S) |
Sheet resistivity
（Film thickness 10μm） |
Viscosity
(at 25℃)
(VT-06) |
Curing
condition |
| SW1100-1 |
General-purpose product |
300/300 μm |
80mΩ/□ |
110-210 dPa･s |
150℃×20min |
| SW2200C |
Upgraded product of
SW1100-1(flexibility) |
100/100 μm |
60mΩ/□ |
750-1050 dPa･s |
150℃×30min |
Silver paste for vacuum forming
For curved surface 3D of sensors such as touch panel.
| Products |
Outline |
Stretching property |
Resistivity |
Viscosity
(at 25℃)
(VT-06) |
Curing
condition |
| LS-611-1 |
Thermal dry type |
90% |
300mΩ/□ |
400-600 dPa･s |
100℃×30min |
Silver paste for elastic substrate
For wearable and stretchable electronics applications.
| Products |
Outline |
Max.stretch ratio
at forming |
Resistivity |
Viscosity
(at 25℃)
(VT-06) |
Curing
condition |
| LS-453-6B |
Thermal dry type |
100% |
100mΩ/□ |
300-500 dPa･s |
80℃×30min |
