Silver paste

Silver paste for touch screen, membrane circuit.

Application to ITO-PET film is possible. Wide array of usage purposes such as touch screen switch, membrane circuit formation, and EL element application.

Products Outline Printability Sheet resistivity
(Film thickness 10μm)
Viscosity
(at 25℃)
(VT-06)
Curing
condition
LS-450-5 For fine printing application,
good adhesion to
various kinds of ITO
70-80 μm 65mΩ/□ 600-800 dPa・s 130℃×30min
LS-450-7H For fine printing application,
good adhesion to
thin film type ITO
50-60 μm 80mΩ/□ 1100-1400 dPa・s 130℃×30min
LS-460H-1 For fine printing application,
great with various screens
50 μm 90mΩ/□ 1200-1800 dPa・s 130℃×30min
LS-453-1 Low temperature curing type 80-100 μm 50mΩ/□ 350-450 dPa・s 100℃×30min

 

 

Ag paste for laser cutting process

Products Outline Workability
(L/S)
Sheet resistivity
(Film thickness 10μm)
Viscosity
(at 25℃)
(VT-06)
Curing
condition
LS-470L-2 General-purpose product 30/30 μm 85mΩ/□ 350-450 dPa・s 130℃×30min
SNP-120L General-purpose,
Large particle reduced product
20/20 μm 60mΩ/□ 350-450 dPa・s 130℃×30min
SNP-210L Lowes-cost,
Large particle reduced product
20/20 μm 70mΩ/□ 200-400 dPa・s 130℃×30min
SNP-300L-SP2 Low temperature curing,
Large particle reduced product
20/20 μm 70mΩ/□ 350-450 dPa・s 80℃×30min
 

 

Silver paste for EMI shielding

By securing specified film thickness, it is possible to obtain good EMI shielding effect.
Charactecteristics such as high-flexibility can be maintained even during bending tests in low temperature environments.

Products Outline Printability
(L/S)
Sheet resistivity
(Film thickness 10μm)
Viscosity
(at 25℃)
(VT-06)
Curing
condition
SW1100-1 General-purpose product 300/300 μm 80mΩ/□ 110-210 dPa・s 150℃×20min
SW1600C Upgraded product of
SW1100-1(flexibility)
300/300 μm 80mΩ/□ 200-300 dPa・s 150℃×20min

 

 

Silver paste for vacuum forming

For curved surface 3D of sensors such as touch panel.

Products Outline Max.stretch ratio
at forming
Resistivity Viscosity
(at 25℃)
(VT-06)
Curing
condition
LS-610-3 Thermal dry type 80% 400mΩ/□ 500-700 dPa・s 100℃×30min

 

 

Silver paste for elastic substrate

For wearable and stretchable electronics applications.

Products Outline Max.stretch ratio
at forming
Resistivity Viscosity
(at 25℃)
(VT-06)
Curing
condition
LS-453-6B Thermal dry type 100% 100mΩ/□ 300-500 dPa・s 80℃×30min