Etching resist ink

Masking ink used for etching copper and ITO.
Acid resistant, alkali removable type.

For Cu etching / Swelling peeling type

Products Outline Viscosity
(at 25℃)
(VT-06)
Curing condition
DPER-23B-A 1 component type,
Photo patterning type
100-150 dPa・s 80℃×10min
→100mJ/cm2
UVR-E21BP 1 component type,
UV curing type
300-500 dPa・s 1000mJ/cm2

 

For ITO etching / Dissolution peeling type

Products Outline Viscosity
(at 25℃)
(VT-06)
Curing condition
UVR-E31BP 1 component type,
UV curing type
300-500 dPa・s 1000mJ/cm2
WR-520GZ(KAI) 1 component type,
Heat drying type
100-160 dPa・s 80℃×5min