Photo solder resist ink for Flexible substrate

Alkaline-developable photo solder resist ink for FPC substrate

Good adhesion to FPC and high flexibility.

Products Outline Color Fire retardancy UV expose
(mJ/cm2)
Viscosity
(at25℃)
Curing condition
DPR-75FCV-8 2 component type,
For FPC, Low exposure,
High resolution
Black Equivalant to
VTM-0 (UL94)
100 130-150 dPa・s 150℃×60min