For touch panel
| Group | Application | Product | Feature |
|---|---|---|---|
| Silver paste | Conductive circuit | LS-450 Series | Fine printablity |
| LS-460 H-1 | Fine printablity | ||
| LS-453-1 | Low temperature curing type | ||
| LS-470L-2 | For Laser-cutting process, General-purpose product |
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| SNP Series | For Laser-cutting process, New product |
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| Resist ink | Conductive circuit protection | CR-18T-KT1 | General-purpose product |
| FR-1T-NSD9 | High transparency | ||
| FR-410T-NF2 | High transparency | ||
| FR-231C-2 | Black color, High hiding performance |
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| UVF-10T-DS | UV curing type, Dot-spacer application |
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| UVF-DS3 | UV curing type, Dot-spacer application |
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| UVF-10T(KAI) | UV curing type, General-purpose product |
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| UVF-31T | UV curing type, High adhesion. |
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| UVF-70T | UV curing type, High adhesion. |
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| UVR-100 | Thermal dry + UV curing type, High transparency |
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| UVR-200(611) | UV curing type, High transparency |
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| Masking ink | Temporary protect for ITO & glass | #503F(EX)P | Vinyl-chloride series, General-purpose product |
| #626B-5P | Acrylic resin series, General-purpose product |
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| #381□-17 | Environment-responsive | ||
| #UV-345T | UV curing type, Low odor |
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| #WWS-2T | Thermal dry type, Water soluble type |
For special substrates
| Group | Application | Product | Feature |
|---|---|---|---|
| Silver paste | Conductive circuit | LS-611-1 | For vacuum forming |
| LS-453-6B | For elastic substrate | ||
| Carbon paste | FTU-100P-1 | For vacuum forming | |
| FTU-2K-SC2 | For elastic substrate | ||
| Resist ink | Conductive circuit protection | CR-80T-11 | For vacuum forming |
| CR-121T-1 | For elastic substrate |
For PCB/FPC fabrications
| Group | Application | Product | Feature |
|---|---|---|---|
| Silver paste | EMI shield | SW1100-1 | General-purpose product |
| SW2200C | Upgraded product of flexibility | ||
| Carbon paste | Printed film resistor | TU-○○-8 Series | For fixed resistance |
| BTU-○○-10 Series | For sliding resistance | ||
| Rigid substrate | TU-10S | General-purpose product | |
| Flexible substrate | FTU-16R | General-purpose product | |
| FTU-30LT2 | Low temperature curing type | ||
| Copper paste | Conductive circuit | ACP-100 | General-purpose product |
| Resist ink | Flexible substrate | CR-18CL-CK | Thermosetting type, General-purpose product |
| CR-62B | Thermosetting type, Excellent flexibility |
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| DPR-75FCV-8 | Photo type, Low exposure |
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| CR-18WL-HR | Thermosetting type, For LED application |
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| Rigid substrate | There are some variations. Please ask us. | ||
For plating process
| Group | Application | Product | Feature |
|---|---|---|---|
| Plating resist ink | Electro-less Ni/Au plating | MR-300CF-D | General-purpose product |
| MR-303F | Low contamination to electroless- plating solution |
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| MR-303FTHV1 | High viscosity type, Color free type |
For mounting process
| Group | Application | Product | Feature |
|---|---|---|---|
| Adhesive of chip component |
For temporary joint during soldering | SA-33P-2 | General-purpose product |
| SA-350 | Halogen-free type | ||
| SA-500M-1 | Low temperature curing type | ||
| Ag conductive adhesive | Soldering substitution | LS-109 | General-purpose product |
| Heat-resistant masking | Non-stick of solder | #503B-SHP | Vinyl-chloride series, General-purpose product |
| #801B-RP | Acrylic resin series, High heat resistance |
| Group | Application | Product | Feature |
|---|---|---|---|
| Post flux | Rosin | AGF-880 | General-purpose product |
| AGF-880B | Improved workability | ||
| AGF-550BK | Low-residue type | ||
| ANF-20-116 | Low-residue type, For use in nitrogen atmosphere |
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| NH-120KM | Non-halide activator type | ||
| Synthetic resin-based | AHQ-3100K | Ultra low-residue type |