Insulating Paste

Heat Curing Solder resist for FPC

Thermosetting resist for FPC substrate

Dielectric coating paste for flexible printing circuit application
Excellent adhesion on the flexible film substrate

General-purpose
Products Component Color Halogen-free Viscosity(at 25℃) Heat Curing Condition
CR-18CL-CK 2 Black(※1) adjusted 40~100dPa・s
(B-8U)
130℃×10min
Fire retardant type
Products Component Color Halogen-free Viscosity(at 25℃) Heat Curing Condition
FR-181CL 2 Black(※1) adjusted 50~150dPa・s
(B-8U)
130℃×10min
High-insulation reliability
Products Component Color Halogen-free Viscosity(at 25℃) Heat Curing Condition
FR-1C D7 1 Black(※1) adjusted 45~75dPa・s
(B-8U)
130℃×10min
Marking ink
Products Component Color Halogen-free Viscosity(at 25℃) Heat Curing Condition
FR-3C-M 1 Black(※1) adjusted 200~300dPa・s
(VT-04)
150℃×30~60min

※1 There are some color variations.

Thermosetting resist for LED applicaiton

This product has been developed for LED application. Cured film has high reflectance ratio, and it has excellent heat resistance. Cured film has excellent flexibility, even after the reflow process.

Flexibility / Fire retardant / Resistance to discoloration ( against high temperature) / Export rule adjusted
Products Reflection rate Component Color Halogen-free Viscosity
(at 25℃)
Heat Curing Condition
HRP-006-1 86% 2 White adjusted 60~100dpa・s
(B-8U)
130℃×10min

PRODUCTS GUIDE

Insulating Paste

  • Heat Curing Solder resist for FPC
  • Heat Curing Solder resist for FPC
  • photo-solder-resist-for-fpc
  • Photo solder Resist for FPC

Conductive Paste

  • PTF Conductive Paste
  • Copper Paste
  • PTF Resistor Paste

Strippable Mask

  • Strip Mask for ITO
  • Heat-resistant Mask

Flux

  • Soldering Flux

Adhensives

  • Adhensives&Conductive adhesive

Others

  • Etching Resist
  • Via-Plugging Paste

Asahi Chemical Research Laboratory Co., Ltd.

656 Utsuki-cho,Hachioji,Tokyo 192-0024

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