Insulating Paste

Electro-less plating resist

Electro-less Au plating resist

Plating resist is an acid and heet resistant plating resist ink for electroless Au plating.
This ink is capable of selective circult formation in the PWB manufacturing required for thick Au plating.
From FPC application to low-odor type,  a wide variety of products is there.

Low contamination
Products Flexibility Component Viscosity (at25℃) Drying Condition
MR-300CF-D △~×  1 200~240dPa・s 80℃×10min
Low odor
Products Flexibility Component Viscosity (at25℃) Drying Condition
MR-301CC ×  1 80℃×10min 200~300dPas
Flexibility・Low contamination to electroless plating solution
Products Flexibility Component Viscosity (at25℃) Drying Condition
MR-303F  1 100~300dPa・s 100℃×10min

PRODUCTS GUIDE

Insulating Paste

  • Heat Curing Solder resist for FPC
  • Heat Curing Solder resist for FPC
  • photo-solder-resist-for-fpc
  • Photo solder Resist for FPC

Conductive Paste

  • PTF Conductive Paste
  • Copper Paste
  • PTF Resistor Paste

Strippable Mask

  • Strip Mask for ITO
  • Heat-resistant Mask

Flux

  • Soldering Flux

Adhensives

  • Adhensives&Conductive adhesive

Others

  • Etching Resist
  • Via-Plugging Paste

Asahi Chemical Research Laboratory Co., Ltd.

656 Utsuki-cho,Hachioji,Tokyo 192-0024

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