Adhensives

Adhensives&Conductive adhesive

Thermosetting adhesive for chip component

This product is one component type, thermosetting epoxy adhesivesdesigned for fix chip components tentatively on the PWB.

Long time quantity output
Products Color Component Halogen-free Curing condition
SA-33P-2 Red 1 130℃×60sec.
Halogen-free adjusted
Products Color Component Halogen-free Curing condition
SA-350 Red 1 adjusted 130℃×60sec.
Low temperature curing
Products Color Component Halogen-free Curing condition
SA-500M-1 Red 1 95℃×60 sec.

Electrically-conductive adhesive

Adhesion bond with electrically-conductive in the hands of users for long time

General-purpose product
Products Tensile stength(N) Component Viscosity Curing condition
LS-109 ≧ 3kgf 1 500~900 dPa・s 150℃×10 min

Thermosetting sealing material

This is a two-component epoxy resin type, thermo-setting sealing material for the flexible substrate PCB.

Products Feature Component Halogen-free Curing condition
GP-1T-FX High flexibility 2 130℃×30min
GP-15T High adhesion 2 adjusted 130℃×30min

PRODUCTS GUIDE

Insulating Paste

  • Heat Curing Solder resist for FPC
  • Heat Curing Solder resist for FPC
  • photo-solder-resist-for-fpc
  • Photo solder Resist for FPC

Conductive Paste

  • PTF Conductive Paste
  • Copper Paste
  • PTF Resistor Paste

Strippable Mask

  • Strip Mask for ITO
  • Heat-resistant Mask

Flux

  • Soldering Flux

Adhensives

  • Adhensives&Conductive adhesive

Others

  • Etching Resist
  • Via-Plugging Paste

Asahi Chemical Research Laboratory Co., Ltd.

656 Utsuki-cho,Hachioji,Tokyo 192-0024

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